$269 million awarded for 33 projects under the Microelectronics Commons initiative. The Department of Defense announced a total of $269 million in awards for microelectronics manufacturing capacity and…
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Commerce Department Announces Preliminary Agreement with HP
$50 million in funding would expand an Oregon manufacturing facility. The Department of Commerce recently announced that it has reached a preliminary manufacturing expansion with HP Inc. The…
Read MoreU.S. Commerce Secretary Holds Meeting with Korean Minister of Trade
The two leaders discussed the progress in semiconductor production and other collaborative efforts. U.S. Department of Commerce Secretary Gina Raimondo and Korean Minister of Trade, Industry, and Energy…
Read MoreHouse Committee Announces Critical Mineral Supply Policy Group
Legislators will develop measures to transition the U.S. away from reliance on Chinese minerals. The members of the House Select Committee on China recently announced a new work…
Read MoreSupreme Court Agrees to Nvidia Class Action Appeal
The company calls allegations of misleading revenue statements “speculative litigation.” The Supreme Court agreed to hear an appeal filed by Nvidia, which claimed that a revived class action…
Read MoreCommerce Department Announces Agreement with SolAero
A $23 Million preliminary agreement would expand radiation-resistant semiconductors for solar panels. The Commerce Department recently signed a non-binding preliminary agreement with SolAero Technologies under the CHIPS and…
Read MoreCommerce Department Signs Preliminary Agreement with Korean Affiliate
The semiconductor component manufacturing company will build U.S. facility. The Department of Commerce signed a preliminary memorandum of terms with Absolics, an affiliate South Korean company that produces…
Read MoreCommerce Department Effort to Recruit Women in Construction
Secretary Raimondo says CHIPS Act goals will not be achieved without them. The Department of Commerce released its framework for encouraging women to become construction workers, saying that…
Read MoreCommerce Department Announces Agreement for Samsung Chip Facilities
Preliminary agreement proposes investing $6.4 billion into facility construction and expansion in Texas. The Department of Commerce announced that it has reached a non-binding domestic manufacturing agreement with…
Read MorePreliminary Agreement with Taiwan Semiconductor Manufacturer Announced
President Biden says, if finalized, will provide $6.6 billion to build U.S.-based manufacturing facilities This week, President Joe Biden announced a preliminary agreement with the Taiwan Semiconductor Manufacturing…
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